Focusing on market-driven solutions, the Electronics Components (EC) Technology Division specialises in advanced packaging technologies, materials and devices development, and module integration. Its technologies cater to applications in the electronics sector particularly in the consumer, automotive, power and energy segments.
EC seeks to develop leading-edge core competence in advanced value-added power electronics products with significant cost and performance improvement. Its solutions are useful for many smart city applications such as Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV), data centres and new energy sources. The three key core competence groups under EC – Power Devices (POWER), Packaging (PACK) and Intelligent Devices Energy (IDE) – continue to pursue advance R&D for various technology solutions and industry applications, reinforcing EC’s leading role in each of its core areas of competence.