20140801 - 20160531
(1) 3D-SiP technology platform, including dual frequency tunable antenna design, integrated passive device (IPD) design, hybrid substrate design, embedded passive & active design, package structure (e.g., Ball Grid Array(BGA) & Flip Chip(FC)) design, 3D integration method development, low power consumption method, and system security protection solution etc., will be established for miniaturized dual-frequency RFID reader (MDR) module development. (2) Substrate fabrication process including embedded passive and active devices, module packaging (e.g., BGA & FC) and system 3D integration related manufacturing process recipes will be developed. Dual band antenna prototype samples (antenna return loss > 15dB for both frequencies) and integrated MDR SiP 1st round prototype samples (dimension – 15×15×1.2 mm3; output power – 27dBm for UHF) will be developed using the to-be-developed process recipes. (3) Report on tunable secure RFID reader system including RFID reader tuning algorithm, embedded security method and reliability testing results of the MDR SiP. (4) Complete the Smartphone integration with SiP module and demonstrate at least one specific user scenario.
Dr James Zhibin LEI Ms YH KWAN Dr Jun CHEN Mr IP, Eric SO Dr Yan LIU Mr KW, Ken YEUNG Ms Fiona WANG Dr Yang YUE Mr Haifeng FU Mr W K LUK Dr Weiming FU Mr Simon WONG Ms Sally XU Mr Bin XIE Ms Karina KO Mr Xiaoyu ZHAO
Chengdu RML Technology Co. LTD [赞助机构] China Chippacking Technology Co. LTD China Chippacking Technology Co. LTD (Technology Licensing) [赞助机构] GE Intelligent Technology Company Limited Gean Technology Co. Ltd. 万联科技有限公司 WINSUN Technology Development Limited [赞助机构] WINSUN Technology Development Limited (Technology Licensing) [赞助机构]