Visual Signal Processing Technology for Emerging 3D Applications
20100701 - 20120930
Dr Shen-chang Chao
1) A research platform for emerging 3D applications. The platform is highly scalable and extendable for developing various future 3D applications. 2) A fast high-quality 2D-to-3D Image Generation on embedded solution applicable to digital photo frame. 3) 5 patents to be filed on key developed technologies.
City University of Hong Kong National Cheng Kung University The Chinese University of Hong Kong The Hong Kong Polytechnic University The Hong Kong University of Science and Technology
In this digital era, video entertainment plays an important role in our everyday life. We are now enjoying high quality video through digital broadcasting/streaming, packaged media and portable electronics devices. Notably High-definition video has been widely adopted in digital video products and 3D viewing is believed to be the upcoming trend. Our human visual system has the ability to utilize binocular depth cues (binocular parallax and convergence) to perceive the world in three-dimension. In today’s 2D-based video entertainment, the display devices are not providing realistic depth perception. Migrating to 3D is a progression towards our natural viewing. 3D viewing and related applications are forecasted to be the next era of video entertainment. To progress towards commercialization of this new technology, we take the lead to conduct applied research specific for 3D-related applications. In this project, we team up with five top-tier universities in Hong Kong and Greater China to develop essential technologies applicable for emerging 3D applications especially for 3D content creation and 3D content distribution. These universities include City University of Hong Kong (CityU), The Chinese University of Hong Kong (CUHK), The Hong Kong Polytechnic University (PolyU), The Hong Kong University of Science and Technology (HKUST) and National Cheng Kung University (NCKU). These technologies will be integrated into a unified research platform which can later be used for application development and future research. Intellectual Properties (IPs) generated during the project will empower Hong Kong and Greater China industry to compete in the 3D market.