Cost-effective TDD/FDD LTE RF Transceiver
20121010 - 20141009
Mr Bill Weimin Zhang
Dual-mode RF Transceiver Architecture and System • Dual-mode TDD/FDD LTE multi-band reconfigurable design • MIMO design and implementation • SAW-less transceiver architecture for FDD mode • System and modules specifications definition Timeframe: within 20 months after project kickoff Dual-mode RF Transceiver Modules IP • Modules IP design in terms of schematics, simulation and layout • Modules include RF front-end modules, frequency synthesizer modules, ADC/DAC, serial interface and etc; Timeframe: within 20 months after project kickoff Dual-mode RF Transceiver Chips • RF transceiver engineering samples for LTE 3GPP Release 9. A few silicon tapeouts are planned. Timeframe: within 24 months after project kickoff Demo Boards • Demo boards for the RF transceiver chips to function and test in a platform Timeframe: within 24 months after project kickoff
Dr Che-I, Justin CHUANG Mr Jui Kuang, Ray HO Mr Wai Po WONG Dr Gang, Dennis QIAN Mr Huimin, Henry GUO Mr Kai-cheung, Tim CHUNG Dr Wang Chi, Charles CHENG Dr Shuzuo LOU Mr Lefeng, Victor SHEN Mr Xiaoming, Michael CHEN Dr Dan, Rachel WANG Mr To Shing WONG Mr Jinghong, Perry ZHU Mr Chi Fung, Camel LOK Mr Zhiwei WU Ms Yan WAN Ms Mei Fan, Rebecca CHOI Ms Angel CHEUNG Dr Xin Yi LIU Mr Koon Man, Angus SAM Dr Shiyuan Zheng Mr Chiing Chyuan, Calvin Lee Mr Yi, Jesse AI Mr Jianbiao LONG Dr Shaohua ZHAO Mr K, Benjamin HUI
Innofidei (Hong Kong) Technology Limited Innofidei (Hong Kong) Technology Limited (Licensing Income) [Sponsor] Shanghai Huahong Integrated Circuit Co. Ltd. (SHHIC) The Chinese University of Hong Kong The Hong Kong University of Science and Technology
LTE (Long Term Evolution) has been selected by most operators in the world as the evolution of their cellular networks. In this full project, a cost-effective dual-mode multi-band RF transceiver will be developed for TDD/FDD LTE standard 3GPP Release 9. The transceiver will support FDD band 1, 7, 11/9, 13/17, TDD band 38, 40, 42 and 43 covering major countries/regions such as China/HK, US, Japan, Australia, UK and Europe. Key areas in cost-effective TDD/FDD LTE terminal RF transceiver implementation, such as SAW-less (Surface Acoustic Wave) transceiver architecture to remove board level SAW filters, dual-mode reconfigurability, MIMO (Multiple Input Multiple Output), direct conversion zero-IF architecture, low noise high linearity front-end, reconfigurable low pass filter, integrated fractional-N PLL (Phase Locked Loop) will be explored. A few MPW tapeouts have been planned to produce silicon verified IP. Reference design and TDD/FDD LTE terminal RF transceiver chip will be delivered as the achievements of this project. This project will help Hong Kong set up a technology leading role in China and create a competitive edge for local IC design houses, OEM and ODM manufacturers.