PI ELECTRONICS (HONG KONG) LIMITED (Sponsor)
ROBOTICS ROBOTICS LIMITED (Sponsor)
The project aims at developing the technology foundations for supporting the Realization of Robotic Manipulation System for Manufacturing Assembly Process for the next generations of Smart Factory by adopting the Digital and Physical Twins Approach. In a Manufacturing Assembly Process, the final assembly is produced by having parts being added sequentially in each workcell and semi-finished assemblies being mechanically moved from workcell to workcell. By adopting the Digital and Physical Twins Approach, Manufacturing Assembly Process can be designed, optimized and validated via the Digital Twin before the actual deployment via the Physical Twin. By utilizing Model-Based System Engineering (MBSE) approach, Manufacturing Process Digitalization, Motion Planning and Optimization as well as Realization of Optimized Manufacturing Process are conducted in this project to enable the Digital Transformation of Manufacturing Assembly Process by utilizing Robotic Manipulation System. The Robotic Manipulation System, which consists of two Robotic Arms and one Vision System, is designed to be able to conduct Control and Coordination for some domain-specific tasks so that the application-driven and time-consuming programming for Vision System and spatial-dependent and performance-oriented path planning for Robotic Manipulation could be automated. The primitive tasks to be conducted in the Manufacturing Assembly Process include screwing, winding, taping, insertion and picking and placing. The capabilities developed in this project are to be demonstrated in two specific manufacturing application examples. This project will serve as an example on showing how a Smart Factory could be designed and implemented based on Model-Based Systems Engineering (MBSE) paradigm to support the Re-Industrialization of Hong Kong.