[30 August 2018, Hong Kong] China’s first “Third-generation Semiconductor Power Electronics Technology Roadmap” (the “Roadmap”) was released by China Advanced Semiconductor Industry Innovation Alliance (CASA) on 31 July 2018. The Hong Kong Applied Science and Technology Research Institute (ASTRI) was invited to assist in the Roadmap development process – by providing professional advice, communicating with relevant overseas institutions, and helping with the essential drafting and compilation work. ASTRI has been the only institution from Hong Kong involved in the Roadmap’s drafting and compilation process.
The third-generation semiconductors are core materials for electronic components which facilitate innovative growth, development and transformation of many industries. It has long wielding impact on sectors ranging from mobile communications to Internet of Energy (IoE), new energy vehicles to railway, and even public security to national defence. Major world economies like the US, European Union and Japan strive hard to excel in this area. This Roadmap focuses on power electronics in four areas: substrate /epitaxy/device, packaging/module, application of silicon carbide (SiC) and application of gallium nitride (GaN). It also sets out a recommended R&D direction for China’s power electronics as well as third-generation semiconductor sectors, while analysing the industry’s current and future development trends.
Ms Wu Ling, Chairman of the Strategic Alliance on Innovation and Technology for the 3rd Generation of the Semiconductor Industry, and Director of the Wide Band Gap Semiconductor Programme Office at the Ministry of Science and Technology (MOST) said, “This latest Roadmap focuses on power electronics with major implications for industries such as IoE, new energy vehicle and consumer electronics.” The Roadmap will help the Government to “better define a national R&D strategy focusing on core priorities, amplify the market’s future development potential, and facilitate effective collaboration between businesses, scholars and R&D centres.” It will also help enterprises to figure out the most optimal timing for initiating and launching new innovations.
The drafting and compilation process of the Roadmap involved working together with local and overseas universities (e.g. Tsinghua University, Peking University, etc), R&D institutions (e.g. Institute of Semiconductors and Institute of Microelectronics at the Chinese Academy of Sciences), leading enterprises (e.g. State Grid Corporation of China, CRRC Corporation), scholars and professionals for more than a year. Led by CASA, the process was supported by, among others, ASTRI. ASTRI has been the only institution from Hong Kong invited to take part in the formulation of the roadmap. It sent a team of six experts to assist in the drafting and compilation work with its Senior Director of Electronics Components Dr Daniel Shi appointed as one of the expert consultants for the Roadmap. Dr Shi also joined other experts and the CASA team in meetings on this topic in Europe and the US, conveying views of the Chinese semiconductor and electronics industry to international organisations on technologies and standards such as Institute of Electrical and Electronics Engineers (IEEE). These engagements and views formed the cornerstone of the first international roadmap for third-generation semiconductors soon to be released by the IEEE.
Expressing ASTRI’s delight to be the only institution from Hong Kong participating in the drafting and compilation of the Roadmap, Mr Hugh Chow, Chief Executive Officer of ASTRI said: “It is not only a recognition of ASTRI’s talents, technological capabilities and vision, but also a valuable opportunity for us to contribute to the development of the Chinese semiconductor industry. We hope the roadmap will help the industry of the Mainland as well as Hong Kong, to better understand the China’s strategy and pace on the development of third-generation semiconductors. There is a world of opportunities out there which our industry players can leverage and unleash.”
Hong Kong Applied Science and Technology Research Institute Company Limited (ASTRI) was founded by the Government of the Hong Kong Special Administrative Region in 2000 with the mission of enhancing Hong Kong’s competitiveness in technology-based industries through applied research. ASTRI’s core R&D competencies in various areas are organised under seven Technology Divisions, namely Communications Technologies, Electronics Components, Mixed Signal Systems IC, Advanced Digital Systems, Optoelectronics, Security and Data Sciences, and Intelligent Software and Systems. Five areas of applications including financial technologies, intelligent manufacturing, next generation network, health technologies, and smart city are identified for major pursuit. For further information about ASTRI, please visit www.astri.org.
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